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Stacked Die Bonder (DAF Process):KB-3100
Stacked Die Bonder (DAF Process):KB-3100
  • * Combine 1st-bond & 2nd-bond unit to improve throughput.
  • * High throughput for DAF process (UPH > 2.5K).
  • * 2nd-bond unit with four independent bonding heads which can independent control bond height and bond force.
  • * Substrate pre-heating function to improve DAF bonding quality.
  • * Dual feeding system with two independently controlled stage-feeding unit for continuous operation.
  • * Improve the quality of substrate transfer by stable feeding unit.(stage unit without jam issue of substrate indexing )
  • * Adjustable scraper unit for 1 mil thin die pick-up solution.
張欽華

T:886-2-22682216 #2001

E:algo@gmmcorp.com.tw



規格

Bonding Accuracy

±25μm(X/Y placement),±0.5degree(θ rotation)

Throughput(UPH)

4K(by die size: 240mil x 240mil、2nd-bond time 2.5sec.)

Wafer Size 8 inch ~ 12 inch

Die Size

0.6x0.6mm~25x25mm/1 mil thickness

Subtrate / Lead-frame size

(L)100~270mm x (W)20~95mm x (T)0.1~2mm

Substrate Feeding System

carrier boat feeding type

Stacked-die capability can set X、Y、Z、θ position & bonding time、bond force on every stacked-die at one pad

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