KS-856／852
1.High speed 6S inspection solution for chip sorting.
2.Switchable flip function for face down/up application.
3.Large die size range(0.5-50mm) inspection.
4.Flexible load/unload system option for waffle pack/JEDEC tray/tape reel
5.Die thickness measurement optional.
1.Accuracy:X,Y= ± 30μm , θ=± 0.2°
2.Cycle Time:≦ 0.3 sec/chip (exclude process time)
3.Chip size:0.5mm～ 20 mm (option: ~2 x 50mm or customized)
4.Die Thickness:0.10 mm～2 mm (2mil Option)
5.Pick up force: 50~150g
6.Wafer Size:12” Standard (8” Option)
7.Input Load/Unload : Automatic
8. Tray size:2”,3”,4”
9.Output Load/Unload : Automatic
10.Binning Capability :3 bins(Option 6 bins)
11.Topside /Backside insp.:Chipping, Crack, Residue glue , defect size>10um
12.Side wall inspection:Chipping, Crack, defect size>10um
13.Mapping:Easy mapping/File mapping/Barcode auto loading
KS-812
1.Quick and easy change among 2, 3, 4-inch trays.
2.Dual feeder for continuous tray operation.
3.High speed and reliable linear Pick & Place module.
4.Particle-proof design for tray transfer system.
5.Real time chip backside inspection in P&P process (option function) .
6.Automatic bin sorting system for 3 or 6 bins of chips.
7.Wafer mapping function available.
1.Accuracy : X,Y=±50μm,θ=±0.5°
2.Cycle Time : ≤0.6sec (Excluding pick and place delay time)
3.Chip Size : 0.5~35mm【10 ≦ Chip Dimension (L/W) ≦ 55】
4.Die Thickness: 02.mm~0.7mm
5..Wafer Size : 12″Standard (8″Option)
6.Input Load/Unload :Automatic
7.Tray Size : 2″3″4″chip tray
8.Output Load/Unload : Automatic
9.Binning Capability : Single bin、3or6 bins(option)
10.Mapping: Easy mapping/File mapping
KS-850
1.Automatic bin sorting system for single bin & multi bin.
2.Quickly change tape frame design.
3.Output Feeder stage for 8² and 12² is changeable.
4.Wafer mapping function is available.
5.Wafer /Carrier available, kit exchange easily.
6.High speed and reliable linear Pick & Place module.
1.Accuracy : X,Y=±50μm,θ=±0.2°
2.Cycle Time : ≤0.5 sec(Excluding pick and place delay time)
3.chip size : 0.6×0.6mm~25x25mm
4.Die thickness :0.2mm~0.7mm
6.Wafer Size : >12″ Standard(8″ Option)
7.Input Load/Unload : Automatic
8.Output Load/Unload : Automatic
9.Binning Capability : Single bin/Multi Bin
10.Flip funcition:Option
11.Mapping : Easy mapping/File mapping/Barcode reader(Option)
12.Tack Time(for wafer change at unloader) : ≤10 sec
KS-956／962
1.High Speed 6S inspection solution for chip sorting.
2.Side wall inspection:Chipping, Crack, defect size 30um.
3.NG die output:Place bad die(by inspection)on tray for rework or review.
4.Barcode reader:For mapping file confirming.
5.SECS:For mapping data transfer (option)
1.Accuracy:X,Y= ± 40μm , θ=± 0.2°
2.Cycle Time:≦ 0.24 sec/chip (exclude process time)
3.chip size:1mm～ 9mm
4.Die Thickness:0.10mm~0.7mm
5..Pickup force:50~150g
6.Wafer Size:12” Standard (8” Option)
7.Input Load/Unload:Automatic
9.Output Wafer Load/Unload :Automatic
10.Topside /Backside insp:Chipping, Crack, defect size>10um /Chipping, Crack, Residue glue , defect size>30um
11.Side wall inspection:Chipping, Crack, defect size 30um
12.Mapping:Easy mapping / file mapping
KS-962JL
1.4-Heads pick & place module.
2.AOI & Die transfer parallel processing Preciser.
3.High speed 12-Heads rotary module.
4.Dual working tray table for quick exchange Take & supply trays in run state.
5.Pre-peeling module is available.
6.Quick wafer exchange module is available.
7.Heating ejector is available.
1.Accuracy:X,Y= ± 30μm , θ=± 0.2°
2.chip size:1mm～ 30mm (option: customized)
3.Die Thickness:0.10 mm～3mm (Option)
4.Pickup force:50~150g
5.Wafer Size : 8″/12″ Standard(Option:customized)
6.Input Load/Unload : Automatic
7.Mapping:Easy mapping / file mapping
5.Dimension:3000(W)x1440(D)x1650(H) mm /x 2150mm(H) with signal tower / weight 2150Kg